PCIe 3.0 Dynamic Link EQ: De-Emphasis, Preshoot, Cursors, and Presets

Figure 1: De-emphasis, a key transmit-side equalization
technique for PCIe 3.0, boosts high-frequency content

In an earlier post, we looked at some of the basics of dynamic link equalization for PCIe 3.0, and in particular the reasons why it's not only necessary but mandated by the PCI-SIG for compliance testing. Essentially, the boost in data rates from 5 GT/s in PCIe 2.0 to 8 GT/s in PCIe 3.0 wreaked havoc in terms of signal integrity in the channel. The solution is found in equalization both before (TxEQ) and after (RxEQ) the channel.

The Hows and Whys of PCIe 3.0 Dynamic Link Equalization

Figure 1: SI problems are the root cause for
dynamic link equalization in PCIe 3.0

If you're designing a computer peripheral these days, chances are that you'll use the Peripheral Component Interconnect Express (PCIe) protocol for communication between the device and the host system. With the emergence of PCIe, a bunch of older bus standards were kicked to the curb. PCIe itself became the basis for more specialized standards, most notably ExpressCard for laptop expansion cards and SATA Express for storage interfaces.

DDR Memory Testing Part IV: Preparing for Testing

Figure 1: For compliance testing,
DDR transition density should
be as high as possible

The first three installments of this series of posts on DDR memory testing are largely concerned with mechanical issues related to probing, use of interposers, and/or damping resistors. Now, we will turn our attention to the preliminaries of DDR testing itself: generating DDR traffic with which to exercise the memory interface, and criteria for a proper read/write burst pattern that will gain good test results.

DDR Memory Testing Part III: What Not to Do

Figure 1: Damping resistors on
solder-in probe tips

Testing of dual data-rate memory (DDR) devices and/or modules calls for careful application of some best practices for probing. There will also be cases where the use of chip interposers is called for. Heeding the advice provided in earlier Test Happens posts on this topic will go a long way toward successful probing and testing.

DDR Memory Testing Part II: Using Interposers

Figure 1: The anatomy of a chip interposer

If you're a PCB layout designer, you've probably heard one or more test engineers complain: "Why can't you lay out the board so that it can be tested?" All too often, components that need to be accessible to oscilloscope probes are physically inaccessible, whether it's because of close proximity of adjacent components or ball grid array (BGA) mounting of the DUT. It's nearly always a necessary evil, though, because of PCB cost and/or mechanical constraints.

Eliminate Pitfalls of DDR Memory Testing

Figure 1: DDR test configuration
for a desktop computer

Since its inception as a standard in the mid 1990s, dual data-rate (DDR) SDRAM memory has been near ubiquitous in computing applications. Compared to single data-rate SDRAM, the DDR SDRAM interface makes higher transfer rates possible by more strict control of the timing of the electrical data and clock signals.

Oscilloscope Basics: Using The Display Graticule

Figure 1: The display graticule, the grid of intersecting lines
overlaying the signal display area, is the original
oscilloscope measurement tool

Today's digital oscilloscopes come packed with an abundance of measurement capabilities, all available at the touch of a button or two. Want to know the amplitude of a square wave? Easy. Want to know the standard deviation of that amplitude? Minimum/maximum or mean? All easily compiled for you over hundreds or thousands of acquisitions.