Fundamentals of Power Integrity: Board Pollution

Figure 1. "Pollution" occurring on PDN traces.

Board pollution is noise occurring on the packages and interconnects (traces and planes) that carry current from the VRMs to the consumer devices.
One place it can originate is from the VRM itself, for example, with the switching noise the VRM generates (Figure 1). That can be a real concern if the board capacitance means you have a resonance around the switching frequency that would act as an amplifier for the switching noise and cause all kinds of problems with other devices on the board.

Fundamentals of Power Integrity: Self-aggression Noise

Fig. 1: VRM-switching noise is a self aggressor that can be
identified because it is synchronous with the PWM clock. 

Self-aggression noise is so-called because it is inflicted by a component onto itself through its normal operation; nothing else in the system is affecting it. When we look for this, we want to ensure the system is in a steady state, in a place where the noise environment is fairly clear (e.g., the device is on an evaluation board).

An example of self-aggression would be VRM-switching noise. Figure 1 shows ripple on a 900 millivolt rail (yellow trace) at a time when no load is present. One of the things that tells us this is switching noise is that it is synchronous to the PWM clock (red trace). Ripple that is synchronous with the switching clock is a typical figure of merit for identifying switching noise.

Making On-Die Power-Rail Measurements (Part III)

Figure 1: This screen capture shows
the idle-state conditions

Having reviewed the test setup for on-die power-rail testing and our expectations of what the tests should show us, let's walk through the measurements and look over the results. We'll also note whether our results align with our expectations or are outside of those expectations.

Making On-Die Power-Rail Measurements (Part I)

Figure 1: Our test setup for the
on-die measurement examples

Our exploration of on-die power-rail measurements has brought us to the point of demonstrating some examples of these measurements. As noted in the prior post, we will use an Atmel 328 microcontroller demo board, prepared with firmware to control it explicitly for our purposes, and with coaxial cable in place on the bottom of the board to serve as transmission lines for our signals of interest.

Setting the Stage for On-Die Power-Rail Measurements

Figure 1: Measuring on-die Vdd rail noise requires
a suitably instrumented die and package

Armed with a suitable oscilloscope and active voltage-rail probe, you're now ready to make some power-rail measurements on a semiconductor die. Of course, making measurements on a die is a little different than making measurements on a printed-circuit board. This is where careful design-for-test at the die level comes in, because the chip, its packaging, and the board on which it will be mounted must be instrumented so as to make the on-die measurements possible.

The Power Delivery 2.0 Protocol in Action

Figure 1: A high-level view of a PD 2.0 power
contract negotiation

The Power Delivery 2.0 protocol brings a boatload of intelligence to the process of establishing power relationships between partners in a USB Type-C link. In previous posts, we've examined the basics of the two standards, the workings of USB Type-C cable detection, how dual-role port devices are handled, and PD 2.0 messaging. Next, let's look at PD 2.0 in action by deconstructing the initialization of a Google Chromebook laptop, which was one of the first Power Delivery devices on the market.

USB Type-C and Dual-Role Port Devices

Figure 1: This protocol analyzer capture
shows how a DRP alternates between
voltage source and sink until it sees one
or the other at the far end of a link

At this juncture in our ongoing series of posts about USB Type-C and power delivery, it's time to acknowledge that some Type-C devices are not strictly a power source or sink. Some are called out in the Power Delivery 2.0 specification as dual-role port (DRP) devices that may act as either a source or sink for power. Note that unlike in the original OTG spec, this applies only to a port's power role, not to being a USB host or connected device.

USB Type-C and Power Delivery Messaging

Figure 1: Power Delivery messaging comprises two types:
Control and Data

Continuing our review of USB Type-C and the associated Power Delivery 2.0 (PD) specification, let's now turn to PD message types. Whereas USB was originally conceived as primarily a serial-data interface with limited power-delivery capabilities, the proliferation of power-hungry mobile devices has forced a rethinking of that conception. With PD 2.0 came a much more flexible, and capable, power-delivery functionality for USB. PD messaging is a critical component in this regard.

USB Type-C Cable Detection

Figure 1: The four possible states of
connection for a USB Type-C cable

Having examined some of the basics regarding the USB Type-C connector and the Power Delivery 2.0 specification that complements the Type-C spec itself, we'll turn our attention to the topic of cable detection. The Type-C connector is reversible, which is to say there are four ways a cable can be connected between upstream- and downstream-facing ports (Figure 1). Not only that, but there are different types of Type-C cables. So how do the devices discern what's between them?

A Look at USB Type-C and Power Delivery

Figure 1: The USB Type-C
connector alongside its
Micro-B counterpart

With USB 3.1, the latest iteration of the serial-data protocol, comes a new smaller and universal connector: USB Type-C, the USB-IF's answer to Apple's Lightning connector (Figure 1). Even Apple itself has adopted USB Type-C for its latest MacBooks, a rare show of support from Cupertino for an open standard. Like Lightning, USB Type-C is reversible, but it offers other interesting features, such as the ability to handle other protocols using "alternate modes." It also incorporates the new USB Power Delivery specification for improved power-supply capabilities over USB.