9 Quick Fixes to Improve DDR Probing

Figure 1: Reversed Handsfree mounts and chip
clips help relieve strain on fragile solders.

Probing at DRAM pins as required by JEDEC can be challenging. Here are nine, simple ways to improve your DDR probing.

1. Use positioning tools to relieve strain on probe tips

The Handsfree probe holder included as an accessory with several Teledyne LeCroy probes, such as the WaveLink and DH Series probes, was originally designed to put weight on the probe tip to ensure a good contact. However, many DDR probing applications utilize solder-in (SI) tips, where the greater concern is to relieve strain on the tip so as to not disrupt the solder. It turns out that if you use the Handsfree in a “reverse mounted” orientation (Figure 1), it puts the amplifier in a perfect position to help relieve strain on probe tips.

Probing Techniques and Tradeoffs (Part X): More Best Practices

Figure 1: Chip clips;
they're not just for
snacks anymore

In probing circuits, as with most endeavors, there are some best practices you can use to enhance your chances of obtaining optimal measurements. We began exploring this concept in our last post, and we'll continue here with more best practices.